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Correlations between process, material and quality characteristics and the reliability of solder joints

contributor authorWohlrabe, Heinz
contributor authorPantazica, Mihaela
date accessioned2020-03-12T21:52:38Z
date available2020-03-12T21:52:38Z
date issued2014
identifier other6962792.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063649?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCorrelations between process, material and quality characteristics and the reliability of solder joints
typeConference Paper
contenttypeMetadata Only
identifier padid8196031
subject keywordscomputer crime
subject keywordsn computer network security
subject keywordsn transport protocols
subject keywordsn IP-ARP spoofing detection
subject keywordsn address resolution protocol
subject keywordsn command line execution method
subject keywordsn hacking attack
subject keywordsn network administrator
subject keywordsn Databases
subject keywordsn IP networks
subject keywordsn Internet
subject keywordsn Local area networks
subject keywordsn Protocols
subject keywordsn Software
subject keywordsn Testing
subject keywordsn ARP-Spoofing
subject keywordsn IP-ARP Spoofing and IP-Spoofing
identifier doi10.1109/IndiaCom.2014.6828085
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize3835430
citations0


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