Correlations between process, material and quality characteristics and the reliability of solder joints
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/IndiaCom.2014.6828085
کلیدواژه(گان): computer crime,n computer network security,n transport protocols,n IP-ARP spoofing detection,n address resolution protocol,n command line execution method,n hacking attack,n network administrator,n Databases,n IP networks,n Internet,n Local area networks,n Protocols,n Software,n Testing,n ARP-Spoofing,n IP-ARP Spoofing and IP-Spoofing
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آمار بازدید
Correlations between process, material and quality characteristics and the reliability of solder joints
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| contributor author | Wohlrabe, Heinz | |
| contributor author | Pantazica, Mihaela | |
| date accessioned | 2020-03-12T21:52:38Z | |
| date available | 2020-03-12T21:52:38Z | |
| date issued | 2014 | |
| identifier other | 6962792.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1063649?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Correlations between process, material and quality characteristics and the reliability of solder joints | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8196031 | |
| subject keywords | computer crime | |
| subject keywords | n computer network security | |
| subject keywords | n transport protocols | |
| subject keywords | n IP-ARP spoofing detection | |
| subject keywords | n address resolution protocol | |
| subject keywords | n command line execution method | |
| subject keywords | n hacking attack | |
| subject keywords | n network administrator | |
| subject keywords | n Databases | |
| subject keywords | n IP networks | |
| subject keywords | n Internet | |
| subject keywords | n Local area networks | |
| subject keywords | n Protocols | |
| subject keywords | n Software | |
| subject keywords | n Testing | |
| subject keywords | n ARP-Spoofing | |
| subject keywords | n IP-ARP Spoofing and IP-Spoofing | |
| identifier doi | 10.1109/IndiaCom.2014.6828085 | |
| journal title | lectronics System-Integration Technology Conference (ESTC), 2014 | |
| filesize | 3835430 | |
| citations | 0 |