date accessioned | 2020-03-12T21:51:36Z | |
date available | 2020-03-12T21:51:36Z | |
date issued | 2014 | |
identifier other | 6961804.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1063060?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | [Copyright notice] | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8195144 | |
subject keywords | boundary scan testing | |
subject keywords | n integrated circuit bonding | |
subject keywords | n probes | |
subject keywords | n three-dimensional integrated circuits | |
subject keywords | n 3D SIC | |
subject keywords | n IEEE1149.4 | |
subject keywords | n Kelvin probe | |
subject keywords | n SPICE simulation | |
subject keywords | n analog boundary-scan | |
subject keywords | n bond resistance | |
subject keywords | n electrical probes | |
subject keywords | n high density post-bond TSV | |
subject keywords | n resistance measuring method | |
subject keywords | n serial microbumps | |
subject keywords | n Current measurement | |
subject keywords | n Electrical resistance measurement | |
subject keywords | n Measurement uncertainty | |
subject keywords | n Pollution measurement | |
subject keywords | n Resistance | |
subject keywords | n Through-silicon vias | |
identifier doi | 10.1109/ICEP.2014.6826673 | |
journal title | nformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o | |
filesize | 94204 | |
citations | 0 | |