[Copyright notice]
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سال
: 2014شناسه الکترونیک: 10.1109/ICEP.2014.6826673
کلیدواژه(گان): boundary scan testing,n integrated circuit bonding,n probes,n three-dimensional integrated circuits,n 3D SIC,n IEEE1149.4,n Kelvin probe,n SPICE simulation,n analog boundary-scan,n bond resistance,n electrical probes,n high density post-bond TSV,n resistance measuring method,n serial microbumps,n Current measurement,n Electrical resistance measurement,n Measurement uncertainty,n Pollution measurement,n Resistance,n Through-silicon vias
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[Copyright notice]
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| date accessioned | 2020-03-12T21:51:36Z | |
| date available | 2020-03-12T21:51:36Z | |
| date issued | 2014 | |
| identifier other | 6961804.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1063060 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | [Copyright notice] | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8195144 | |
| subject keywords | boundary scan testing | |
| subject keywords | n integrated circuit bonding | |
| subject keywords | n probes | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D SIC | |
| subject keywords | n IEEE1149.4 | |
| subject keywords | n Kelvin probe | |
| subject keywords | n SPICE simulation | |
| subject keywords | n analog boundary-scan | |
| subject keywords | n bond resistance | |
| subject keywords | n electrical probes | |
| subject keywords | n high density post-bond TSV | |
| subject keywords | n resistance measuring method | |
| subject keywords | n serial microbumps | |
| subject keywords | n Current measurement | |
| subject keywords | n Electrical resistance measurement | |
| subject keywords | n Measurement uncertainty | |
| subject keywords | n Pollution measurement | |
| subject keywords | n Resistance | |
| subject keywords | n Through-silicon vias | |
| identifier doi | 10.1109/ICEP.2014.6826673 | |
| journal title | nformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o | |
| filesize | 94204 | |
| citations | 0 |