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[Copyright notice]

date accessioned2020-03-12T21:51:36Z
date available2020-03-12T21:51:36Z
date issued2014
identifier other6961804.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063060?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
title[Copyright notice]
typeConference Paper
contenttypeMetadata Only
identifier padid8195144
subject keywordsboundary scan testing
subject keywordsn integrated circuit bonding
subject keywordsn probes
subject keywordsn three-dimensional integrated circuits
subject keywordsn 3D SIC
subject keywordsn IEEE1149.4
subject keywordsn Kelvin probe
subject keywordsn SPICE simulation
subject keywordsn analog boundary-scan
subject keywordsn bond resistance
subject keywordsn electrical probes
subject keywordsn high density post-bond TSV
subject keywordsn resistance measuring method
subject keywordsn serial microbumps
subject keywordsn Current measurement
subject keywordsn Electrical resistance measurement
subject keywordsn Measurement uncertainty
subject keywordsn Pollution measurement
subject keywordsn Resistance
subject keywordsn Through-silicon vias
identifier doi10.1109/ICEP.2014.6826673
journal titlenformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o
filesize94204
citations0


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