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Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module

contributor authorFlowers, C.A.
contributor authorEisler, C.N.
contributor authorAtwater, H.A.
date accessioned2020-03-12T21:06:35Z
date available2020-03-12T21:06:35Z
date issued2014
identifier other6925165.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1037274?show=full
formatgeneral
languageEnglish
publisherIEEE
titleElectrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module
typeConference Paper
contenttypeMetadata Only
identifier padid8163564
subject keywordsintegrated circuit packaging
subject keywordssolders
subject keywordsthermal stress cracking
subject keywordsthree-dimensional integrated circuits
subject keywords3D through-silicon-via interposer package
subject keywordsTSV interposer packages
subject keywordsboard-level solder joint
subject keywordsfinite element analysis
subject keywordshomogenization schemes
subject keywordshomogenous material layer
subject keywordsmicrobump-underfill layer
subject keywordsmicrobumps
subject keywordsmicrosolder balls
subject keywordsmultiscale structure
subject keywordssolder joint fatigue life
subject keywordsthermal fatigue life
subject keywordsElectronic packaging thermal management
subject keywordsFatigue
subject keywordsFinite element analysis
subject keywordsMaterials
subject keywordsSoldering
subject keywordsS
identifier doi10.1109/ICEPT.2014.6922749
journal titlehotovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
filesize656960
citations0


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