Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module
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: 2014DOI: 10.1109/ICEPT.2014.6922749
Keyword(s): integrated circuit packaging,solders,thermal stress cracking,three-dimensional integrated circuits,3D through-silicon-via interposer package,TSV interposer packages,board-level solder joint,finite element analysis,homogenization schemes,homogenous material layer,microbump-underfill layer,microbumps,microsolder balls,multiscale structure,solder joint fatigue life,thermal fatigue life,Electronic packaging thermal management,Fatigue,Finite element analysis,Materials,Soldering,S
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Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module
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| contributor author | Flowers, C.A. | |
| contributor author | Eisler, C.N. | |
| contributor author | Atwater, H.A. | |
| date accessioned | 2020-03-12T21:06:35Z | |
| date available | 2020-03-12T21:06:35Z | |
| date issued | 2014 | |
| identifier other | 6925165.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1037274?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8163564 | |
| subject keywords | integrated circuit packaging | |
| subject keywords | solders | |
| subject keywords | thermal stress cracking | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | 3D through-silicon-via interposer package | |
| subject keywords | TSV interposer packages | |
| subject keywords | board-level solder joint | |
| subject keywords | finite element analysis | |
| subject keywords | homogenization schemes | |
| subject keywords | homogenous material layer | |
| subject keywords | microbump-underfill layer | |
| subject keywords | microbumps | |
| subject keywords | microsolder balls | |
| subject keywords | multiscale structure | |
| subject keywords | solder joint fatigue life | |
| subject keywords | thermal fatigue life | |
| subject keywords | Electronic packaging thermal management | |
| subject keywords | Fatigue | |
| subject keywords | Finite element analysis | |
| subject keywords | Materials | |
| subject keywords | Soldering | |
| subject keywords | S | |
| identifier doi | 10.1109/ICEPT.2014.6922749 | |
| journal title | hotovoltaic Specialist Conference (PVSC), 2014 IEEE 40th | |
| filesize | 656960 | |
| citations | 0 |