| date accessioned | 2020-03-12T20:43:45Z | |
| date available | 2020-03-12T20:43:45Z | |
| date issued | 2014 | |
| identifier other | 6886193.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1023347?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Annealing characteristics of p<sup>+</sup>-Si/n-4H-SiC junctions by using surface-activated bonding | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8148169 | |
| subject keywords | Current measurement | |
| subject keywords | Frequency measurement | |
| subject keywords | Resonant frequency | |
| subject keywords | Temperature measurement | |
| subject keywords | Temperature sensors | |
| subject keywords | Viscosity | |
| subject keywords | high viscosity measurement | |
| subject keywords | parallel plate shear wave transducers | |
| subject keywords | resonating plate viscosity sensing | |
| identifier doi | 10.1109/ICSENS.2014.6984979 | |
| journal title | ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on | |
| filesize | 234149 | |
| citations | 0 | |
| contributor rawauthor | Nishida, S. , Liang, J. , Hayashi, T. , Morimoto, M. , Shigekawa, N. , Arai, M. | |
