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Annealing characteristics of p<sup>+</sup>-Si/n-4H-SiC junctions by using surface-activated bonding

Author:
Nishida, S. , Liang, J. , Hayashi, T. , Morimoto, M. , Shigekawa, N. , Arai, M.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICSENS.2014.6984979
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1023347
Keyword(s): Current measurement,Frequency measurement,Resonant frequency,Temperature measurement,Temperature sensors,Viscosity,high viscosity measurement,parallel plate shear wave transducers,resonating plate viscosity sensing
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    Annealing characteristics of p&lt;sup&gt;+&lt;/sup&gt;-Si/n-4H-SiC junctions by using surface-activated bonding

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date accessioned2020-03-12T20:43:45Z
date available2020-03-12T20:43:45Z
date issued2014
identifier other6886193.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1023347?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleAnnealing characteristics of p<sup>+</sup>-Si/n-4H-SiC junctions by using surface-activated bonding
typeConference Paper
contenttypeMetadata Only
identifier padid8148169
subject keywordsCurrent measurement
subject keywordsFrequency measurement
subject keywordsResonant frequency
subject keywordsTemperature measurement
subject keywordsTemperature sensors
subject keywordsViscosity
subject keywordshigh viscosity measurement
subject keywordsparallel plate shear wave transducers
subject keywordsresonating plate viscosity sensing
identifier doi10.1109/ICSENS.2014.6984979
journal titleow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
filesize234149
citations0
contributor rawauthorNishida, S. , Liang, J. , Hayashi, T. , Morimoto, M. , Shigekawa, N. , Arai, M.
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