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Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration

contributor authorRan He , Yamauchi, A. , Suga, T.
date accessioned2020-03-12T20:43:41Z
date available2020-03-12T20:43:41Z
date issued2014
identifier other6886151.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1023305?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleCu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration
typeConference Paper
contenttypeMetadata Only
identifier padid8148127
subject keywordsConferences
subject keywordsFeature extraction
subject keywordsHistograms
subject keywordsImage color analysis
subject keywordsLighting
subject keywordsStatistical distributions
subject keywordsTopology
subject keywordscolor topology
subject keywordsperson re-identification
subject keywordsspatial structure
subject keywordsvideo surveillance
identifier doi10.1109/ICIP.2014.7025495
journal titleow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
filesize258122
citations0


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