Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration
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: 2014شناسه الکترونیک: 10.1109/ICIP.2014.7025495
کلیدواژه(گان): Conferences,Feature extraction,Histograms,Image color analysis,Lighting,Statistical distributions,Topology,color topology,person re-identification,spatial structure,video surveillance
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Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration
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| contributor author | Ran He , Yamauchi, A. , Suga, T. | |
| date accessioned | 2020-03-12T20:43:41Z | |
| date available | 2020-03-12T20:43:41Z | |
| date issued | 2014 | |
| identifier other | 6886151.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1023305 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8148127 | |
| subject keywords | Conferences | |
| subject keywords | Feature extraction | |
| subject keywords | Histograms | |
| subject keywords | Image color analysis | |
| subject keywords | Lighting | |
| subject keywords | Statistical distributions | |
| subject keywords | Topology | |
| subject keywords | color topology | |
| subject keywords | person re-identification | |
| subject keywords | spatial structure | |
| subject keywords | video surveillance | |
| identifier doi | 10.1109/ICIP.2014.7025495 | |
| journal title | ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on | |
| filesize | 258122 | |
| citations | 0 |