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Now showing items 1-7 of 7

Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

Type: Journal Paper

Author : Yuanchao Li; Wenzhou Ruan; Zheyao Wang

Year: 2013

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Thermal and electrical tests of air-gap TSV

Type: Conference Paper

Author : Cui Huang , Dong Wu , Zheyao Wang

Publisher: IEEE

Year: 2014

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC

Type: Journal Paper

Author : Mengyun Yue; Dong Wu; Zheyao Wang

Publisher: IEEE

Year: 2014

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Type: Journal Paper

Author : Qianwen Chen; Zheyao Wang; Jian Cai; Litian Liu

Publisher: Elsevier Science

Year: 2010

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Reactive ion etching characteristics of partially-cured benzocyclobutene

Type: Conference Paper

Author : Yang Yang; Zhen Song; Yuxin Du; Zheyao Wang

Publisher: IEEE

Year: 2014

Reliability of Au-Si eutectic bonding

Type: Conference Paper

Author : Tianxiang Ye; Zhen Song; Yuxin Du; Zheyao Wang

Publisher: IEEE

Year: 2014

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Type: Journal Paper

Author : Cui Huang; Liyang Pan; Ran Liu; Zheyao Wang

Publisher: IEEE

Year: 2014

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Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

Thermal and electrical tests of air-gap TSV

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Reactive ion etching characteristics of partially-cured benzocyclobutene

Reliability of Au-Si eutectic bonding

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

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Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

Thermal and electrical tests of air-gap TSV

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma&#x2013;Delta ADC

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Reactive ion etching characteristics of partially-cured benzocyclobutene

Reliability of Au-Si eutectic bonding

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC