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نمایش تعداد 1-7 از 7

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

نوع: Journal Paper

ناشر: Allerton Press Inc

سال: 2014

Using software architectures to retrieve interaction information in eLearning environments

نوع: Conference Paper

نویسنده : Cruz Benito, J.; Garcia-Penalvo, F.J.; Theron, R.; Maderuelo, C.; Perez-Blanco, J.S.; Zazo, H.; Martin-Suarez, A.

ناشر: IEEE

سال: 2014

Quality-Driven Design of Web Service Business Processes

نوع: Conference Paper

نویسنده : Zernadji, T.; Tibermacine, C.; Cherif, F.

ناشر: IEEE

سال: 2014

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

نوع: Conference Paper

نویسنده : Liang Jiang; Yongyong He; Xinchun Lu; Jianbin Luo

ناشر: IEEE

سال: 2014

First- and second-order meshless radial point interpolation methods in electromagnetics

نوع: Conference Paper

نویسنده : Shaterian, Z.; Kaufmann, T.; Fumeaux, C.

ناشر: IEEE

سال: 2014

Polarized metal/semiconductor sources based on confined Tamm plasmons

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

نوع: Journal Paper

نویسنده : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

ناشر: IEEE

سال: 2014

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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

Using software architectures to retrieve interaction information in eLearning environments

Quality-Driven Design of Web Service Business Processes

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

First- and second-order meshless radial point interpolation methods in electromagnetics

Polarized metal/semiconductor sources based on confined Tamm plasmons

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

Using software architectures to retrieve interaction information in eLearning environments

Quality-Driven Design of Web Service Business Processes

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

First- and second-order meshless radial point interpolation methods in electromagnetics

Polarized metal/semiconductor sources based on confined Tamm plasmons

Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach