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Now showing items 1-4 of 4
Development of exposed die large body to die size ratio wafer level package technology
Publisher: IEEE
Year: 2014
Adapting a cheap game controller as a natural 3D input
Publisher: IEEE
Year: 2014
Measuring the client performance and energy consumption in mobile cloud gaming
Publisher: IEEE
Year: 2014
Assignment of games to servers in the OnLive cloud game system
Publisher: IEEE
Year: 2014