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Now showing items 1-9 of 9

A low-complexity sub-Nyquist sampling system for wideband Radar ESM receivers

Type: Conference Paper

Publisher: IEEE

Year: 2014

Codes with locality for two erasures

Type: Conference Paper

Author : Prakash, N. , Lalitha, V. , Kumar, P.V.

Publisher: IEEE

Year: 2014

Error rate analysis and optimal power allocation in multiple access relay channels with Analog Network Coding

Type: Conference Paper

Publisher: IEEE

Year: 2014

Indoor positioning of wheeled devices for Ambient Assisted Living: A case study

Type: Conference Paper

Publisher: IEEE

Year: 2014

Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

Type: Journal Paper

Author : Li Jiang; Lei, Thomas Guangyin; Ngo, Khai D. T.; Guo-Quan Lu; Shufang Luo

Publisher: IEEE

Year: 2014

Multiphase parallel interleaved and primary-parallel secondary-series forward micro-inverter comparison

Type: Conference Paper

Author : Meneses, D.; Garcia, O.; Alou, P.; Oliver, J.A.; Cobos, J.A.

Publisher: IEEE

Year: 2014

Study on nonlinear PID control for electro-hydrostatic actuator

Type: Conference Paper

Author : Fan, Jizhong; Ling, Dongyao; Tang, Zhiyong; Pei, Zhongcai

Publisher: IEEE

Year: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Effects of Extreme Temperature Swings ( <inline-formula> <img src="/images/tex/21686.gif" alt="-\\hbox {55} ^{\\circ}\\hbox {C}"> </inline-formula> to 250 <inline-formula> <img src="/images/tex/762.gif" alt="^{\\circ}\\hbox {C}"> </inline-formula>) on Silicon Nitride Active Metal Brazing Substrates

Type: Journal Paper

Author : Fukumoto, Ayako; Berry, Dave; Ngo, Khai D. T.; Guo-Quan Lu

Publisher: IEEE

Year: 2014

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A low-complexity sub-Nyquist sampling system for wideband Radar ESM receivers

Codes with locality for two erasures

Error rate analysis and optimal power allocation in multiple access relay channels with Analog Network Coding

Indoor positioning of wheeled devices for Ambient Assisted Living: A case study

Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

Multiphase parallel interleaved and primary-parallel secondary-series forward micro-inverter comparison

Study on nonlinear PID control for electro-hydrostatic actuator

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Effects of Extreme Temperature Swings ( <inline-formula> <img src="/images/tex/21686.gif" alt="-\\hbox {55} ^{\\circ}\\hbox {C}"> </inline-formula> to 250 <inline-formula> <img src="/images/tex/762.gif" alt="^{\\circ}\\hbox {C}"> </inline-formula>) on Silicon Nitride Active Metal Brazing Substrates

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A low-complexity sub-Nyquist sampling system for wideband Radar ESM receivers

Codes with locality for two erasures

Error rate analysis and optimal power allocation in multiple access relay channels with Analog Network Coding

Indoor positioning of wheeled devices for Ambient Assisted Living: A case study

Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

Multiphase parallel interleaved and primary-parallel secondary-series forward micro-inverter comparison

Study on nonlinear PID control for electro-hydrostatic actuator

Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach

Effects of Extreme Temperature Swings ( <inline-formula> <img src="/images/tex/21686.gif" alt="-\\hbox {55} ^{\\circ}\\hbox {C}"> </inline-formula> to 250 <inline-formula> <img src="/images/tex/762.gif" alt="^{\\circ}\\hbox {C}"> </inline-formula>) on Silicon Nitride Active Metal Brazing Substrates

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach