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Gateway diversity for Q/V feeder links: Requirements, characteristics, and challenges

Type: Conference Paper

Author : Kyrgiazos, A.; Evans, B.

Publisher: IEEE

Year: 2014

Smart digital podoscope for foot deformity assessment

Type: Conference Paper

Author : Laowattanatham, N.; Chitsakul, K.; Tretriluxana, S.; Hansasuta, C.

Publisher: IEEE

Year: 2014

Transient simulation of fixed-speed wind turbine with grid fault variety in real wind farm

Type: Conference Paper

Author : Mehrshad, M. , Effatnejad, R. , Mohammadpour, A.

Publisher: IEEE

Year: 2014

Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO<sub>2</sub>/Silicone Encapsulation Layer

Type: Journal Paper

Author : Huai Zheng; Lan Li; Xiang Lei; Xingjian Yu; Sheng Liu; Xiaobing Luo

Publisher: IEEE

Year: 2014

CMcloud: Cloud Platform for Cost-Effective Offloading of Mobile Applications

Type: Conference Paper

Publisher: IEEE

Year: 2014

Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services

Type: Conference Paper

Author : Chichin, S.; Chhetri, M.B.; Quoc Bao Vo; Kowalczyk, R.; Stepniak, M.

Publisher: IEEE

Year: 2014

Context-aware wireless broadcast for next generation cellular networks

Type: Conference Paper

Author : Huang, Linyu; Sung, Chi Wan; Chen, Chung Shue

Publisher: IEEE

Year: 2014

Robust power converters in integrated systems

Type: Conference Paper

Author : Massoud, Y.; Shuang Li; Smaili, S.

Publisher: IEEE

Year: 2014

Dynamical networks with on-off stochastic connections: Beyond fast switching

Type: Conference Paper

Author : Jeter, R. , Belykh, I.

Publisher: IEEE

Year: 2014

Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Type: Journal Paper

Author : Jae-Won Jang; Kyoung-Lim Suk; Jin-Hyoung Park; Kyung-Wook Paik; Soon-Bok Lee

Publisher: IEEE

Year: 2014

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Gateway diversity for Q/V feeder links: Requirements, characteristics, and challenges

Smart digital podoscope for foot deformity assessment

Transient simulation of fixed-speed wind turbine with grid fault variety in real wind farm

Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO<sub>2</sub>/Silicone Encapsulation Layer

CMcloud: Cloud Platform for Cost-Effective Offloading of Mobile Applications

Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services

Context-aware wireless broadcast for next generation cellular networks

Robust power converters in integrated systems

Dynamical networks with on-off stochastic connections: Beyond fast switching

Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

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Gateway diversity for Q/V feeder links: Requirements, characteristics, and challenges

Smart digital podoscope for foot deformity assessment

Transient simulation of fixed-speed wind turbine with grid fault variety in real wind farm

Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO<sub>2</sub>/Silicone Encapsulation Layer

CMcloud: Cloud Platform for Cost-Effective Offloading of Mobile Applications

Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services

Context-aware wireless broadcast for next generation cellular networks

Robust power converters in integrated systems

Dynamical networks with on-off stochastic connections: Beyond fast switching

Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition