Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services
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سال
: 2014شناسه الکترونیک: 10.1109/ICEPT.2014.6922764
کلیدواژه(گان): chip-on-board packaging,cooling,electronic engineering computing,finite element analysis,glass,light emitting diodes,thermal analysis,thermal management (packaging),ANSYS software,COB heat dissipation performance,LED chip packaging,chip gaps,chip sizes,chip-on-board,glass substrate,heat dissipation performance,insulation,light transmission,optimized packaging structure,packaging material,substrate material,substrate thickness,thermal analysis,thermal management scheme,Gla
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Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services
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| contributor author | Chichin, S. | |
| contributor author | Chhetri, M.B. | |
| contributor author | Quoc Bao Vo | |
| contributor author | Kowalczyk, R. | |
| contributor author | Stepniak, M. | |
| date accessioned | 2020-03-12T21:10:48Z | |
| date available | 2020-03-12T21:10:48Z | |
| date issued | 2014 | |
| identifier other | 6928211.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1039776 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8166665 | |
| subject keywords | chip-on-board packaging | |
| subject keywords | cooling | |
| subject keywords | electronic engineering computing | |
| subject keywords | finite element analysis | |
| subject keywords | glass | |
| subject keywords | light emitting diodes | |
| subject keywords | thermal analysis | |
| subject keywords | thermal management (packaging) | |
| subject keywords | ANSYS software | |
| subject keywords | COB heat dissipation performance | |
| subject keywords | LED chip packaging | |
| subject keywords | chip gaps | |
| subject keywords | chip sizes | |
| subject keywords | chip-on-board | |
| subject keywords | glass substrate | |
| subject keywords | heat dissipation performance | |
| subject keywords | insulation | |
| subject keywords | light transmission | |
| subject keywords | optimized packaging structure | |
| subject keywords | packaging material | |
| subject keywords | substrate material | |
| subject keywords | substrate thickness | |
| subject keywords | thermal analysis | |
| subject keywords | thermal management scheme | |
| subject keywords | Gla | |
| identifier doi | 10.1109/ICEPT.2014.6922764 | |
| journal title | eb Intelligence (WI) and Intelligent Agent Technologies (IAT), 2014 IEEE/WIC/ACM International Joint | |
| filesize | 820889 | |
| citations | 0 |