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نمایش تعداد 1-10 از 14

Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators

نوع: Conference Paper

نویسنده : Kuraishi, K.; Nanahara, T.

ناشر: IEEE

سال: 2014

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

نوع: Conference Paper

نویسنده : Yun Zhuang; Sampurno, Y.; Borucki, L.; Philipossian, A.

ناشر: IEEE

سال: 2014

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

نوع: Journal Paper

نویسنده : Li Zheng; Yue Zhang; Gang Huang; Bakir, Muhannad S.

ناشر: IEEE

سال: 2014

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

نوع: Journal Paper

نویسنده : Shi-Yu Huang; Jeo-Yen Lee; Kun-Han Tsai; Wu-Tung Cheng

ناشر: IEEE

سال: 2014

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

نوع: Journal Paper

نویسنده : Jiwoo Pak; Sung Kyu Lim; Pan, David Z.

ناشر: IEEE

سال: 2014

Power management of shipboard power systems using Interaction Balance Principle

نوع: Conference Paper

نویسنده : Amgai, Ranjit; Abdelwahed, Sherif

ناشر: IEEE

سال: 2014

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

نوع: Conference Paper

نویسنده : Valdez, Justin; Zhang, Xun; Torres, Jackeline Abad; Roy, Sandip

ناشر: IEEE

سال: 2014

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

نوع: Conference Paper

نویسنده : Stark, Nina; Hay, Alex E.; Trowse, Greg

ناشر: IEEE

سال: 2014

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

نوع: Conference Paper

نویسنده : Tazzoli, Augusto; Malobabic, Slavica; Vashchenko, Vladislav

ناشر: IEEE

سال: 2014

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

نوع: Journal Paper

نویسنده : Athikulwongse, Krit; Ekpanyapong, M.; Sung Kyu Lim

ناشر: IEEE

سال: 2014

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Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Power management of shipboard power systems using Interaction Balance Principle

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

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Fundamental study on voltage stability of induction generators for wind power generation &#x2014; Voltage-power curves for various types of generators

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Power management of shipboard power systems using Interaction Balance Principle

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators