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Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications

Type: Journal Paper

Author : Xiaoying Wang; Dezhi Wang; Yihang Yang; Dandan Liang; Xiaojia Dong

Publisher: IEEE

Year: 2014

Loss analysis and soft-switching characteristics of flyback-forward high gain DC/DC converter with GaN FET

Type: Conference Paper

Author : Zhang Yajing , Zheng, T.Q. , Li Yan

Publisher: IEEE

Year: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Influence of Magnetic Field Annealing on Magnetic Properties for Nanocrystalline <formula formulatype="inline"> <img src="/images/tex/21435.gif" alt="({\\rm Fe}_{0.5}{\\rm Co}_{0.5})_{73.5}{\\rm Cu}_{1}{\\rm Mo}_{3}{\\rm Si}_{13.5}{\\rm B}_{9}"> </formula> Alloy

Type: Journal Paper

Author : Hao Zhang; Zhi Wang; Zhuan-ping Wen; Jia Wang

Publisher: IEEE

Year: 2014

Author

Dandan Liang (1)

Dezhi Wang (1)

Hamilton, Michael C. (1)

Hao Zhang (1)

Jia Wang (1)

Johnson, R. Wayne (1)

Kun Fang (1)

Xiaojia Dong (1)

Xiaoying Wang (1)

Yihang Yang (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

/sub&gt (3)

sub&gt (3)

3&lt (2)

annealing (2)

(Fe&lt (1)

)&lt (1)

-Ar-O (1)

0.5&lt (1)

13.5&lt (1)

2&lt (1)

Type

Journal Paper (3)

Conference Paper (1)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (2)

Magnetics, IEEE Transactions on (1)

ower Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International (1)

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