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A TSV-Based Bio-Signal Package With <formula formulatype="inline"> <img src="/images/tex/241.gif" alt="\\mu"> </formula>-Probe Array

Type: Journal Paper

Author : Lei-Chun Chou; Shih-Wei Lee; Po-Tsang Huang; Chih-Wei Chang; Cheng-Hao Chiang; Shang-Lin Wu; Ching-Te Chuang; Jin-Chern Chiou; Wei Hwang; Chung-Hsi Wu; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Type: Journal Paper

Author : Chun-Chuan Chi; Bing-Yang Lin; Cheng-Wen Wu; Min-Jer Wang; Hung-Chih Lin; Ching-Neng Peng

Publisher: IEEE

Year: 2014

Multi-phase negotiation for single-item bidding

Type: Conference Paper

Publisher: IEEE

Year: 2014

Analyzing the cumulative interfering noise in multi-hop IEEE 802.11 networks

Type: Conference Paper

Author : Chenfei Zhang; Lei Lei; Ting Zhang

Publisher: IEEE

Year: 2014

Impacts of Pheromone Modification Strategies in Ant Colony for Data-Intensive Service Provision

Type: Conference Paper

Author : Wang, Lijuan; Shen, Jun; Luo, Junzhou

Publisher: IEEE

Year: 2014

Temporal evolution of fast and slow waves during propagation through bovine cancellous bone in vitro

Type: Conference Paper

Author : Wear, K.; Nagatani, Y.; Mizuno, K.; Matsukawa, M.

Publisher: IEEE

Year: 2014

A double input SMV controlled DC/DC buck-boost converter for solar PV/wind energy sources

Type: Conference Paper

Publisher: IEEE

Year: 2014

Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network

Type: Journal Paper

Author : Cheoljon Jang; Jaehwan Kim; Jongwha Chong

Publisher: IET

Year: 2014

PLL-Assisted Timing Circuit for Accurate TSV Leakage Binning

Type: Journal Paper

Author : Shi-Yu Huang; Li-Ren Huang

Publisher: IEEE

Year: 2014

Dynamic Stress Modeling on Wafer Thinning Process and Reliability Analysis for TSV Wafer

Type: Journal Paper

Author : Fa Xing Che

Publisher: IEEE

Year: 2014

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A TSV-Based Bio-Signal Package With <formula formulatype="inline"> <img src="/images/tex/241.gif" alt="\\mu"> </formula>-Probe Array

On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Multi-phase negotiation for single-item bidding

Analyzing the cumulative interfering noise in multi-hop IEEE 802.11 networks

Impacts of Pheromone Modification Strategies in Ant Colony for Data-Intensive Service Provision

Temporal evolution of fast and slow waves during propagation through bovine cancellous bone in vitro

A double input SMV controlled DC/DC buck-boost converter for solar PV/wind energy sources

Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network

PLL-Assisted Timing Circuit for Accurate TSV Leakage Binning

Dynamic Stress Modeling on Wafer Thinning Process and Reliability Analysis for TSV Wafer

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A TSV-Based Bio-Signal Package With <formula formulatype="inline"> <img src="/images/tex/241.gif" alt="\\mu"> </formula>-Probe Array

On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Multi-phase negotiation for single-item bidding

Analyzing the cumulative interfering noise in multi-hop IEEE 802.11 networks

Impacts of Pheromone Modification Strategies in Ant Colony for Data-Intensive Service Provision

Temporal evolution of fast and slow waves during propagation through bovine cancellous bone in vitro

A double input SMV controlled DC/DC buck-boost converter for solar PV/wind energy sources

Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network

PLL-Assisted Timing Circuit for Accurate TSV Leakage Binning

Dynamic Stress Modeling on Wafer Thinning Process and Reliability Analysis for TSV Wafer