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Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor

Type: Conference Paper

Author : Di Federico, M.; Julian, P.; Andreou, A.G.; Mandolesi, P.S.

Publisher: IEEE

Year: 2014

High-resolution imaging of damaged wooden structures for building inspection by polarimetric radar

Type: Conference Paper

Author : Liu, H.; Koyama, C.N.; Takahashi, K.; Sato, M.

Publisher: IEEE

Year: 2014

Stereoscopic 3D Web: From idea to implementation

Type: Conference Paper

Author : Wenmin Wang; Shengfu Dong; Ronggang Wang; Qinshui Cheng; Jianlong Zhang; Zhongxin Liu

Publisher: IEEE

Year: 2014

Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip

Type: Conference Paper

Author : Che, F.X.; Lin, Jong-Kai; Au, K.Y.; Zhang, Xiaowu

Publisher: IEEE

Year: 2014

Performance Comparison of Major Classical Face Recognition Techniques

Type: Conference Paper

Author : Bhat, Farooq Ahmad; Wani, M.Arif

Publisher: IEEE

Year: 2014

Engineering large gelatin nanospheres coated with quantum dots for targeted delivery of human osteosarcoma with enhanced cellular internalization

Type: Conference Paper

Author : Tse, Wai Hei; Gyenis, Laszlo; Litchfield, David W.; Zhang, Jin

Publisher: IEEE

Year: 2014

Poselet-based multiple human identification and cosegmentation

Type: Conference Paper

Author : Zhu, Hongyuan; Lu, Jiangbo; Cai, Jianfei; Zheng, Jianmin; Thalmann, Nadia M.

Publisher: IEEE

Year: 2014

Integrated electronic and microfluidic packaging for CMOS biosensor chip

Type: Conference Paper

Author : Ding, Mian Zhi; Kantak, Chaitanya; Rao, Vempati Srinivasa; Park, Mi Kyoung; Wong, Chee Chung

Publisher: IEEE

Year: 2014

Scientific Workflow Repeatability through Cloud-Aware Provenance

Type: Conference Paper

Author : Hasham, Khawar; Munir, Kamran; Shamdasani, Jetendr; McClatchey, Richard

Publisher: IEEE

Year: 2014

Low Complexity Target Coverage Heuristics Using Mobile Cameras

Type: Conference Paper

Author : Neishaboori, Azin; Saeed, Ahmed; Harras, Khaled; Mohamed, Amr

Publisher: IEEE

Year: 2014

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Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor

High-resolution imaging of damaged wooden structures for building inspection by polarimetric radar

Stereoscopic 3D Web: From idea to implementation

Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip

Performance Comparison of Major Classical Face Recognition Techniques

Engineering large gelatin nanospheres coated with quantum dots for targeted delivery of human osteosarcoma with enhanced cellular internalization

Poselet-based multiple human identification and cosegmentation

Integrated electronic and microfluidic packaging for CMOS biosensor chip

Scientific Workflow Repeatability through Cloud-Aware Provenance

Low Complexity Target Coverage Heuristics Using Mobile Cameras

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Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor

High-resolution imaging of damaged wooden structures for building inspection by polarimetric radar

Stereoscopic 3D Web: From idea to implementation

Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip

Performance Comparison of Major Classical Face Recognition Techniques

Engineering large gelatin nanospheres coated with quantum dots for targeted delivery of human osteosarcoma with enhanced cellular internalization

Poselet-based multiple human identification and cosegmentation

Integrated electronic and microfluidic packaging for CMOS biosensor chip

Scientific Workflow Repeatability through Cloud-Aware Provenance

Low Complexity Target Coverage Heuristics Using Mobile Cameras