Search

Now showing items 1-7 of 7

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

Type: Journal Paper

Publisher: Allerton Press Inc

Year: 2014

Using software architectures to retrieve interaction information in eLearning environments

Type: Conference Paper

Author : Cruz Benito, J.; Garcia-Penalvo, F.J.; Theron, R.; Maderuelo, C.; Perez-Blanco, J.S.; Zazo, H.; Martin-Suarez, A.

Publisher: IEEE

Year: 2014

Quality-Driven Design of Web Service Business Processes

Type: Conference Paper

Author : Zernadji, T.; Tibermacine, C.; Cherif, F.

Publisher: IEEE

Year: 2014

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

Type: Conference Paper

Author : Liang Jiang; Yongyong He; Xinchun Lu; Jianbin Luo

Publisher: IEEE

Year: 2014

First- and second-order meshless radial point interpolation methods in electromagnetics

Type: Conference Paper

Author : Shaterian, Z.; Kaufmann, T.; Fumeaux, C.

Publisher: IEEE

Year: 2014

Polarized metal/semiconductor sources based on confined Tamm plasmons

Type: Conference Paper

Publisher: IEEE

Year: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Search

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

Using software architectures to retrieve interaction information in eLearning environments

Quality-Driven Design of Web Service Business Processes

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

First- and second-order meshless radial point interpolation methods in electromagnetics

Polarized metal/semiconductor sources based on confined Tamm plasmons

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Feâ€“Ni Solder Joints

Using software architectures to retrieve interaction information in eLearning environments

Quality-Driven Design of Web Service Business Processes

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

First- and second-order meshless radial point interpolation methods in electromagnetics

Polarized metal/semiconductor sources based on confined Tamm plasmons

Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach