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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

contributor authorXin Chang
contributor authorLeung Tsang
date accessioned2020-03-12T18:35:44Z
date available2020-03-12T18:35:44Z
date issued2014
identifier issn2156-3950
identifier other6680773.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/963738?show=full
formatgeneral
languageEnglish
publisherIEEE
titleFast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations
typeJournal Paper
contenttypeMetadata Only
identifier padid7997107
subject keywordsS-matrix theory
subject keywordsboundary integral equations
subject keywordsimpedance matrix
subject keywordsintegrated circuit modelling
subject keywordsintegrated circuit packaging
subject keywordssurface charging
subject keywordsthree-dimensional integrated circuits
subject keywordsvias
subject keywords1D line integration
subject keywords3D IC
subject keywordsarbitrarily shaped 3D integrated circuit
subject keywordsarbitrarily shaped power-ground planes
subject keywordsboundary integral equation method
subject keywordsbroadband modeling method
subject keywordscavity boundary
subject keywordscommercial full-wave numerical tool
subject keywordsexciting field coefficients
subject keywordsfinite cavity
subject keywordsgeneralized Foldy-Lax scattering equation m
identifier doi10.1109/TCPMT.2013.2290897
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue4
filesize1732132
citations0


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