Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations
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سال
: 2014شناسه الکترونیک: 10.1109/TCPMT.2013.2290897
کلیدواژه(گان): S-matrix theory,boundary integral equations,impedance matrix,integrated circuit modelling,integrated circuit packaging,surface charging,three-dimensional integrated circuits,vias,1D line integration,3D IC,arbitrarily shaped 3D integrated circuit,arbitrarily shaped power-ground planes,boundary integral equation method,broadband modeling method,cavity boundary,commercial full-wave numerical tool,exciting field coefficients,finite cavity,generalized Foldy-Lax scattering equation m
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آمار بازدید
Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations
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| contributor author | Xin Chang | |
| contributor author | Leung Tsang | |
| date accessioned | 2020-03-12T18:35:44Z | |
| date available | 2020-03-12T18:35:44Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6680773.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/963738?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7997107 | |
| subject keywords | S-matrix theory | |
| subject keywords | boundary integral equations | |
| subject keywords | impedance matrix | |
| subject keywords | integrated circuit modelling | |
| subject keywords | integrated circuit packaging | |
| subject keywords | surface charging | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | vias | |
| subject keywords | 1D line integration | |
| subject keywords | 3D IC | |
| subject keywords | arbitrarily shaped 3D integrated circuit | |
| subject keywords | arbitrarily shaped power-ground planes | |
| subject keywords | boundary integral equation method | |
| subject keywords | broadband modeling method | |
| subject keywords | cavity boundary | |
| subject keywords | commercial full-wave numerical tool | |
| subject keywords | exciting field coefficients | |
| subject keywords | finite cavity | |
| subject keywords | generalized Foldy-Lax scattering equation m | |
| identifier doi | 10.1109/TCPMT.2013.2290897 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 4 | |
| filesize | 1732132 | |
| citations | 0 |