Show simple item record

Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

contributor authorAsh, W.M.
contributor authorMeredith, W.F.
contributor authorBanks, C.A.
contributor authorNeskovski, N.N.
contributor authorWolff, B.
contributor authorMonroe, K.
contributor authorCasasnovas, A.
date accessioned2020-03-13T00:27:09Z
date available2020-03-13T00:27:09Z
date issued2014
identifier issn2156-3950
identifier other6936322.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1147277?show=full
formatgeneral
languageEnglish
publisherIEEE
titleEvaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing
typeJournal Paper
contenttypeMetadata Only
identifier padid8330216
subject keywordsacoustic microscopy
subject keywordsenvironmental testing
subject keywordsintegrated circuit packaging
subject keywordsintegrated circuit reliability
subject keywordsintegrated circuits
subject keywordsC-mode scanning acoustic microscopy
subject keywordsCSAM
subject keywordsPEM
subject keywordsdevice reliability testing
subject keywordsenvironmental testing
subject keywordsoff-the-shelf plastic encapsulated microcircuits
subject keywordsplastic-encapsulated microcircuit dormant storage testing
subject keywordsDelamination
subject keywordsEncapsulation
subject keywordsInspection
subject keywordsIntegrated circuit packaging
subject keywordsPerformance evaluation
subject keywordsDormant storage
subject keywordshighly accelerated stress testing
subject keywordsphysics of failure
identifier doi10.1109/TCPMT.2014.2358574
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue12
filesize5401868
citations0


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record