Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing
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: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2358574
کلیدواژه(گان): acoustic microscopy,environmental testing,integrated circuit packaging,integrated circuit reliability,integrated circuits,C-mode scanning acoustic microscopy,CSAM,PEM,device reliability testing,environmental testing,off-the-shelf plastic encapsulated microcircuits,plastic-encapsulated microcircuit dormant storage testing,Delamination,Encapsulation,Inspection,Integrated circuit packaging,Performance evaluation,Dormant storage,highly accelerated stress testing,physics of failure
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Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing
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| contributor author | Ash, W.M. | |
| contributor author | Meredith, W.F. | |
| contributor author | Banks, C.A. | |
| contributor author | Neskovski, N.N. | |
| contributor author | Wolff, B. | |
| contributor author | Monroe, K. | |
| contributor author | Casasnovas, A. | |
| date accessioned | 2020-03-13T00:27:09Z | |
| date available | 2020-03-13T00:27:09Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6936322.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1147277 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8330216 | |
| subject keywords | acoustic microscopy | |
| subject keywords | environmental testing | |
| subject keywords | integrated circuit packaging | |
| subject keywords | integrated circuit reliability | |
| subject keywords | integrated circuits | |
| subject keywords | C-mode scanning acoustic microscopy | |
| subject keywords | CSAM | |
| subject keywords | PEM | |
| subject keywords | device reliability testing | |
| subject keywords | environmental testing | |
| subject keywords | off-the-shelf plastic encapsulated microcircuits | |
| subject keywords | plastic-encapsulated microcircuit dormant storage testing | |
| subject keywords | Delamination | |
| subject keywords | Encapsulation | |
| subject keywords | Inspection | |
| subject keywords | Integrated circuit packaging | |
| subject keywords | Performance evaluation | |
| subject keywords | Dormant storage | |
| subject keywords | highly accelerated stress testing | |
| subject keywords | physics of failure | |
| identifier doi | 10.1109/TCPMT.2014.2358574 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 12 | |
| filesize | 5401868 | |
| citations | 0 |