Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles
نویسنده:
, , , , , , ,ناشر:
سال
: 2014شناسه الکترونیک: 10.1049/mnl.2014.0187
کلیدواژه(گان): adhesion,electrical resistivity,gold,integrated circuit interconnections,integrated circuit packaging,photolithography,photoresists,platinum,scanning electron microscopy,sputter deposition,thin films,titanium,TGV,Ti-Pt-Au-SiO<,sub>,2<,/sub>,adhesion,bump bonding,dry film resist,four-wire ohm method,fractured bumps,glass integrated circuit chips,glass substrate,packaging processes,photolithography,scanning electron microscopy,sintering,sputter deposition,submicr
کالکشن
:
-
آمار بازدید
Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles
Show full item record
| contributor author | Mimatsu, Hayata | |
| contributor author | Mizuno, Jun | |
| contributor author | Shoji, Shuji | |
| contributor author | Kasahara, T. | |
| contributor author | Shih, Kailing | |
| contributor author | Nomura, Keigo | |
| contributor author | Kanehira, Yukio | |
| contributor author | Ogashiwa, Toshinori | |
| date accessioned | 2020-03-13T00:21:14Z | |
| date available | 2020-03-13T00:21:14Z | |
| date issued | 2014 | |
| identifier issn | 1750-0443 | |
| identifier other | 6891915.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1143566 | |
| format | general | |
| language | English | |
| publisher | IET | |
| title | Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8326193 | |
| subject keywords | adhesion | |
| subject keywords | electrical resistivity | |
| subject keywords | gold | |
| subject keywords | integrated circuit interconnections | |
| subject keywords | integrated circuit packaging | |
| subject keywords | photolithography | |
| subject keywords | photoresists | |
| subject keywords | platinum | |
| subject keywords | scanning electron microscopy | |
| subject keywords | sputter deposition | |
| subject keywords | thin films | |
| subject keywords | titanium | |
| subject keywords | TGV | |
| subject keywords | Ti-Pt-Au-SiO< | |
| subject keywords | sub> | |
| subject keywords | 2< | |
| subject keywords | /sub> | |
| subject keywords | adhesion | |
| subject keywords | bump bonding | |
| subject keywords | dry film resist | |
| subject keywords | four-wire ohm method | |
| subject keywords | fractured bumps | |
| subject keywords | glass integrated circuit chips | |
| subject keywords | glass substrate | |
| subject keywords | packaging processes | |
| subject keywords | photolithography | |
| subject keywords | scanning electron microscopy | |
| subject keywords | sintering | |
| subject keywords | sputter deposition | |
| subject keywords | submicr | |
| identifier doi | 10.1049/mnl.2014.0187 | |
| journal title | Micro & Nano Letters, IET | |
| journal volume | 9 | |
| journal issue | 8 | |
| filesize | 472630 | |
| citations | 0 |