Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT
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سال
: 2014شناسه الکترونیک: 10.1109/SMC.2014.6974442
کلیدواژه(گان): Computer aided instruction,Hospitals,Mobile handsets,Professional activities,Software,communication process,e-health,natural interaction,nomadic workers
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Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT
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| date accessioned | 2020-03-12T23:32:24Z | |
| date available | 2020-03-12T23:32:24Z | |
| date issued | 2014 | |
| identifier other | 6897484.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1115300 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284720 | |
| subject keywords | Computer aided instruction | |
| subject keywords | Hospitals | |
| subject keywords | Mobile handsets | |
| subject keywords | Professional activities | |
| subject keywords | Software | |
| subject keywords | communication process | |
| subject keywords | e-health | |
| subject keywords | natural interaction | |
| subject keywords | nomadic workers | |
| identifier doi | 10.1109/SMC.2014.6974442 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2826247 | |
| citations | 0 | |
| contributor rawauthor | Lall, P. , Deshpande, S. , Junchao Wei , Suhling, J. |