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Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film

contributor authorJing Tao , Mathewson, A. , Razeeb, K.M.
date accessioned2020-03-12T23:32:17Z
date available2020-03-12T23:32:17Z
date issued2014
identifier other6897420.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1115237?show=full
formatgeneral
languageEnglish
publisherIEEE
titleStudy of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film
typeConference Paper
contenttypeMetadata Only
identifier padid8284654
subject keywordsUnified Modeling Language
subject keywordsrobot programming
subject keywordsSysML
subject keywordsUML standard
subject keywordscomplex systems
subject keywordsindustry standard
subject keywordsmodeling language
subject keywordsrobot manipulation task modeling
subject keywordsrobotic systems
subject keywordssystems engineering
subject keywordssystems modeling language
subject keywordsAssembly
subject keywordsMathematical model
subject keywordsModeling
subject keywordsService robots
subject keywordsStandards
subject keywordsUnified modeling language
identifier doi10.1109/CoASE.2014.6899347
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize3050854
citations0


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