Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film
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سال
: 2014شناسه الکترونیک: 10.1109/CoASE.2014.6899347
کلیدواژه(گان): Unified Modeling Language,robot programming,SysML,UML standard,complex systems,industry standard,modeling language,robot manipulation task modeling,robotic systems,systems engineering,systems modeling language,Assembly,Mathematical model,Modeling,Service robots,Standards,Unified modeling language
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Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film
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| contributor author | Jing Tao , Mathewson, A. , Razeeb, K.M. | |
| date accessioned | 2020-03-12T23:32:17Z | |
| date available | 2020-03-12T23:32:17Z | |
| date issued | 2014 | |
| identifier other | 6897420.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1115237 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284654 | |
| subject keywords | Unified Modeling Language | |
| subject keywords | robot programming | |
| subject keywords | SysML | |
| subject keywords | UML standard | |
| subject keywords | complex systems | |
| subject keywords | industry standard | |
| subject keywords | modeling language | |
| subject keywords | robot manipulation task modeling | |
| subject keywords | robotic systems | |
| subject keywords | systems engineering | |
| subject keywords | systems modeling language | |
| subject keywords | Assembly | |
| subject keywords | Mathematical model | |
| subject keywords | Modeling | |
| subject keywords | Service robots | |
| subject keywords | Standards | |
| subject keywords | Unified modeling language | |
| identifier doi | 10.1109/CoASE.2014.6899347 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 3050854 | |
| citations | 0 |