| date accessioned | 2020-03-12T23:26:44Z | |
| date available | 2020-03-12T23:26:44Z | |
| date issued | 2014 | |
| identifier other | 6892335.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1111877?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8280744 | |
| subject keywords | Cloud computing | |
| subject keywords | Contracts | |
| subject keywords | Law | |
| subject keywords | Outsourcing | |
| subject keywords | Risk management | |
| subject keywords | Security | |
| subject keywords | Cloud | |
| subject keywords | Outsourcing | |
| subject keywords | Risk Assessment | |
| subject keywords | Risk Management | |
| subject keywords | Security | |
| identifier doi | 10.1109/ISSREW.2014.80 | |
| journal title | hermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Confere | |
| filesize | 567504 | |
| citations | 0 | |
| contributor rawauthor | Ghodke, N. , Kumbhakarna, D. , Nakanekar, S. , Tonapi, S. | |
