Identification of big data opportunities and challenges in statistics Indonesia
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Year
: 2014DOI: 10.1109/ITHERM.2014.6892309
Keyword(s): adhesives,n chip scale packaging,n failure analysis,n finite element analysis,n silicon-on-insulator,n surface morphology,n thermal management (packaging),n thermomechanical treatment,n SOI Si technology chip packages,n TIM bond line thickness measurement,n TIM materials,n TIM surface morphology,n TIM thermal degradation,n chip center area,n chip tearing,n compressive stress,n finite element modeling,n physical failure analysis,n post power c
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Identification of big data opportunities and challenges in statistics Indonesia
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| contributor author | Mariyah, S. | |
| date accessioned | 2020-03-12T22:31:19Z | |
| date available | 2020-03-12T22:31:19Z | |
| date issued | 2014 | |
| identifier other | 7013148.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1085808?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Identification of big data opportunities and challenges in statistics Indonesia | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8223353 | |
| subject keywords | adhesives | |
| subject keywords | n chip scale packaging | |
| subject keywords | n failure analysis | |
| subject keywords | n finite element analysis | |
| subject keywords | n silicon-on-insulator | |
| subject keywords | n surface morphology | |
| subject keywords | n thermal management (packaging) | |
| subject keywords | n thermomechanical treatment | |
| subject keywords | n SOI Si technology chip packages | |
| subject keywords | n TIM bond line thickness measurement | |
| subject keywords | n TIM materials | |
| subject keywords | n TIM surface morphology | |
| subject keywords | n TIM thermal degradation | |
| subject keywords | n chip center area | |
| subject keywords | n chip tearing | |
| subject keywords | n compressive stress | |
| subject keywords | n finite element modeling | |
| subject keywords | n physical failure analysis | |
| subject keywords | n post power c | |
| identifier doi | 10.1109/ITHERM.2014.6892309 | |
| journal title | CT For Smart Society (ICISS), 2014 International Conference on | |
| filesize | 643310 | |
| citations | 0 |