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contributor authorMariyah, S.
date accessioned2020-03-12T22:31:19Z
date available2020-03-12T22:31:19Z
date issued2014
identifier other7013148.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1085808?show=full
formatgeneral
languageEnglish
publisherIEEE
titleIdentification of big data opportunities and challenges in statistics Indonesia
typeConference Paper
contenttypeMetadata Only
identifier padid8223353
subject keywordsadhesives
subject keywordsn chip scale packaging
subject keywordsn failure analysis
subject keywordsn finite element analysis
subject keywordsn silicon-on-insulator
subject keywordsn surface morphology
subject keywordsn thermal management (packaging)
subject keywordsn thermomechanical treatment
subject keywordsn SOI Si technology chip packages
subject keywordsn TIM bond line thickness measurement
subject keywordsn TIM materials
subject keywordsn TIM surface morphology
subject keywordsn TIM thermal degradation
subject keywordsn chip center area
subject keywordsn chip tearing
subject keywordsn compressive stress
subject keywordsn finite element modeling
subject keywordsn physical failure analysis
subject keywordsn post power c
identifier doi10.1109/ITHERM.2014.6892309
journal titleCT For Smart Society (ICISS), 2014 International Conference on
filesize643310
citations0


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