contributor author | Mariyah, S. | |
date accessioned | 2020-03-12T22:31:19Z | |
date available | 2020-03-12T22:31:19Z | |
date issued | 2014 | |
identifier other | 7013148.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1085808?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Identification of big data opportunities and challenges in statistics Indonesia | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8223353 | |
subject keywords | adhesives | |
subject keywords | n chip scale packaging | |
subject keywords | n failure analysis | |
subject keywords | n finite element analysis | |
subject keywords | n silicon-on-insulator | |
subject keywords | n surface morphology | |
subject keywords | n thermal management (packaging) | |
subject keywords | n thermomechanical treatment | |
subject keywords | n SOI Si technology chip packages | |
subject keywords | n TIM bond line thickness measurement | |
subject keywords | n TIM materials | |
subject keywords | n TIM surface morphology | |
subject keywords | n TIM thermal degradation | |
subject keywords | n chip center area | |
subject keywords | n chip tearing | |
subject keywords | n compressive stress | |
subject keywords | n finite element modeling | |
subject keywords | n physical failure analysis | |
subject keywords | n post power c | |
identifier doi | 10.1109/ITHERM.2014.6892309 | |
journal title | CT For Smart Society (ICISS), 2014 International Conference on | |
filesize | 643310 | |
citations | 0 | |