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An Icepak-PSpice co-simulation method to study the impact of bond wires fatigue on the current and temperature distribution of IGBT modules under short-circuit

contributor authorWu, Rui
contributor authorIannuzzo, Francesco
contributor authorWang, Huai
contributor authorBlaabjerg, Frede
date accessioned2020-03-12T21:42:20Z
date available2020-03-12T21:42:20Z
date issued2014
identifier other6954155.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1057540?show=full
formatgeneral
languageEnglish
publisherIEEE
titleAn Icepak-PSpice co-simulation method to study the impact of bond wires fatigue on the current and temperature distribution of IGBT modules under short-circuit
typeConference Paper
contenttypeMetadata Only
identifier padid8188768
subject keywordsdigital control
subject keywordsn maximum power point trackers
subject keywordsn solar cells
subject keywordsn voltage measurement
subject keywordsn PV panels
subject keywordsn analog circuitry
subject keywordsn digitally-assisted windowed sensing
subject keywordsn dithering digital ripple correlation control
subject keywordsn maximum power point trackers
subject keywordsn microcontroller
subject keywordsn solar photovoltaic MPPT
subject keywordsn tracking error
subject keywordsn voltage measurements
subject keywordsn Current measurement
subject keywordsn Hardware
subject keywordsn Maximum power point trackers
subject keywordsn Power measurement
subject keywordsn Pulse width modulation
subject keywordsn Signal resolution
identifier doi10.1109/APEC.2014.6803540
journal titlenergy Conversion Congress and Exposition (ECCE), 2014 IEEE
filesize1504098
citations0


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