contributor author | Weis, Martin , Johler, Werner | |
date accessioned | 2020-03-12T20:12:23Z | |
date available | 2020-03-12T20:12:23Z | |
date issued | 2014 | |
identifier other | 6857138.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1005840?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Increased contact resistance of switching contacts during current carrying | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8127313 | |
subject keywords | finite element analysis | |
subject keywords | photoelasticity | |
subject keywords | stress analysis | |
subject keywords | three-dimensional integrated circuits | |
subject keywords | MIPE system | |
subject keywords | TSV residual stress | |
subject keywords | finite element method | |
subject keywords | maximum principal stress | |
subject keywords | microinfrared photoelasticity system | |
subject keywords | silicon chip | |
subject keywords | stress distribution | |
subject keywords | stress information | |
subject keywords | Filling | |
subject keywords | Finite element analysis | |
subject keywords | Residual stresses | |
subject keywords | Silicon | |
subject keywords | Through-silicon vias | |
subject keywords | Finite element method | |
subject keywords | Photo-elasticity | |
subject keywords | Stress | |
subject keywords | Through Silicon Via (TSV) | |
identifier doi | 10.1109/ICEPT.2014.6922843 | |
journal title | CEC 2014; The 27th International Conference on Electrical Contacts; Proceedings of | |
filesize | 478350 | |
citations | 0 | |