Increased contact resistance of switching contacts during current carrying
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: 2014DOI: 10.1109/ICEPT.2014.6922843
Keyword(s): finite element analysis,photoelasticity,stress analysis,three-dimensional integrated circuits,MIPE system,TSV residual stress,finite element method,maximum principal stress,microinfrared photoelasticity system,silicon chip,stress distribution,stress information,Filling,Finite element analysis,Residual stresses,Silicon,Through-silicon vias,Finite element method,Photo-elasticity,Stress,Through Silicon Via (TSV)
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Increased contact resistance of switching contacts during current carrying
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| contributor author | Weis, Martin , Johler, Werner | |
| date accessioned | 2020-03-12T20:12:23Z | |
| date available | 2020-03-12T20:12:23Z | |
| date issued | 2014 | |
| identifier other | 6857138.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1005840?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Increased contact resistance of switching contacts during current carrying | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8127313 | |
| subject keywords | finite element analysis | |
| subject keywords | photoelasticity | |
| subject keywords | stress analysis | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | MIPE system | |
| subject keywords | TSV residual stress | |
| subject keywords | finite element method | |
| subject keywords | maximum principal stress | |
| subject keywords | microinfrared photoelasticity system | |
| subject keywords | silicon chip | |
| subject keywords | stress distribution | |
| subject keywords | stress information | |
| subject keywords | Filling | |
| subject keywords | Finite element analysis | |
| subject keywords | Residual stresses | |
| subject keywords | Silicon | |
| subject keywords | Through-silicon vias | |
| subject keywords | Finite element method | |
| subject keywords | Photo-elasticity | |
| subject keywords | Stress | |
| subject keywords | Through Silicon Via (TSV) | |
| identifier doi | 10.1109/ICEPT.2014.6922843 | |
| journal title | CEC 2014; The 27th International Conference on Electrical Contacts; Proceedings of | |
| filesize | 478350 | |
| citations | 0 |