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Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

Type: Conference Paper

Author : Saito, Mikiko; Matsunaga, Kaori; Mizuno, Jun; Nishikawa, Hroshi

Publisher: IEEE

Year: 2014

Relationship between bonding conditions and strength for joints using a Au nanoporous sheet

Type: Conference Paper

Author : Matsunaga, Kaori; Kim, Min-Su; Nishikawa, Hiroshi; Saito, Mikiko; Mizuno, Jun

Publisher: IEEE

Year: 2014

Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles

Type: Journal Paper

Author : Mimatsu, Hayata; Mizuno, Jun; Shoji, Shuji; Kasahara, T.; Shih, Kailing; Nomura, Keigo; Kanehira, Yukio; Ogashiwa, Toshinori

Publisher: IET

Year: 2014

Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI

Type: Journal Paper

Author : Nimur, Masatsugu; Mizuno, Jun; Shoji, Shuji; Sakuma, Keita; Ogino, Hiroshi; Enomoto, Tetsuya; Shigetou, Akitsu

Publisher: IEEE

Year: 2014

Author

Mizuno, Jun (4)

Matsunaga, Kaori (2)

Saito, Mikiko (2)

Shoji, Shuji (2)

Enomoto, Tetsuya (1)

Kanehira, Yukio (1)

Kasahara, T. (1)

Kim, Min-Su (1)

Mimatsu, Hayata (1)

Nimur, Masatsugu (1)

Publisher

IEEE (3)

IET (1)

Year

2014 (4)

Keywords

gold (2)

/sub&gt (1)

2&lt (1)

3-D integration (1)

3D large scale integration (1)

3D LSI (1)

AC-DC power convertors (1)

adhesion (1)

adhesive bonding (1)

adhesive resin (1)

Type

Conference Paper (2)

Journal Paper (2)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

lectronics System-Integration Technology Conference (ESTC), 2014 (2)

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

Micro &amp; Nano Letters, IET (1)

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