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نمایش تعداد 1-8 از 8

Rapidly Void Detection in TSVs With 2-D X-Ray Imaging and Artificial Neural Networks

نوع: Journal Paper

نویسنده : Fuliang Wang; Feng Wang

ناشر: IEEE

سال: 2014

Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks

نوع: Journal Paper

نویسنده : Fuliang Wang; Feng Wang

ناشر: IEEE

سال: 2014

Investigation of Complex Looping Process for Thermosonic Wire Bonding

نوع: Journal Paper

نویسنده : Fuliang Wang; Yun Chen; Lei Han

سال: 2014

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Modeling and Experimental Study of the Kink Formation Process in Wire Bonding

نوع: Journal Paper

نویسنده : Fuliang Wang; Yun Chen; Lei Han

ناشر: IEEE

سال: 2014

Control System Design for Height Measurement of BGA Balls Based on Timed Automata

نوع: Journal Paper

نویسنده : Hengsheng Wang; Zimin Lu; Fuliang Wang

ناشر: IEEE

سال: 2014

Three-dimensional microfabrication of copper column by localized electrochemical deposition

نوع: Journal Paper

نویسنده : Hongbin Xiao; Peng Zeng; Xinyu Ren; Fuliang Wang

سال: 2016

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Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging

نوع: Conference Paper

نویسنده : Yun Chen; Fuliang Wang; Hanxiong Li; Xiuyang Shan

ناشر: IEEE

سال: 2014

Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network

نوع: Journal Paper

نویسنده : Fuliang Wang; Junhui Li; Shaohua Liu; Lei Han

ناشر: IEEE

سال: 2014

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Rapidly Void Detection in TSVs With 2-D X-Ray Imaging and Artificial Neural Networks

Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks

Investigation of Complex Looping Process for Thermosonic Wire Bonding

Modeling and Experimental Study of the Kink Formation Process in Wire Bonding

Control System Design for Height Measurement of BGA Balls Based on Timed Automata

Three-dimensional microfabrication of copper column by localized electrochemical deposition

Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging

Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network

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Rapidly Void Detection in TSVs With 2-D X-Ray Imaging and Artificial Neural Networks

Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks

Investigation of Complex Looping Process for Thermosonic Wire Bonding

Modeling and Experimental Study of the Kink Formation Process in Wire Bonding

Control System Design for Height Measurement of BGA Balls Based on Timed Automata

Three-dimensional microfabrication of copper column by localized electrochemical deposition

Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging

Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network