Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network
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سال
: 2014شناسه الکترونیک: 10.1109/TSM.2014.2310223
کلیدواژه(گان): aluminium alloys,backpropagation,electronic engineering computing,electronics packaging,lead bonding,mechanical strength,neural nets,transducers,wavelet transforms,Al,artificial neural network training,backpropagation,bonding test samples,data acquisition system,fundamental frequency component,heavy aluminum wire wedge bonding strength prediction system,power electronic devices,shear strength,transducer driven current signal,wavelet model,Acoustics,Aluminum,Artificial neura
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آمار بازدید
Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network
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| contributor author | Fuliang Wang | |
| contributor author | Junhui Li | |
| contributor author | Shaohua Liu | |
| contributor author | Lei Han | |
| date accessioned | 2020-03-12T23:51:25Z | |
| date available | 2020-03-12T23:51:25Z | |
| date issued | 2014 | |
| identifier issn | 0894-6507 | |
| identifier other | 6762998.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1125806 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8305514 | |
| subject keywords | aluminium alloys | |
| subject keywords | backpropagation | |
| subject keywords | electronic engineering computing | |
| subject keywords | electronics packaging | |
| subject keywords | lead bonding | |
| subject keywords | mechanical strength | |
| subject keywords | neural nets | |
| subject keywords | transducers | |
| subject keywords | wavelet transforms | |
| subject keywords | Al | |
| subject keywords | artificial neural network training | |
| subject keywords | backpropagation | |
| subject keywords | bonding test samples | |
| subject keywords | data acquisition system | |
| subject keywords | fundamental frequency component | |
| subject keywords | heavy aluminum wire wedge bonding strength prediction system | |
| subject keywords | power electronic devices | |
| subject keywords | shear strength | |
| subject keywords | transducer driven current signal | |
| subject keywords | wavelet model | |
| subject keywords | Acoustics | |
| subject keywords | Aluminum | |
| subject keywords | Artificial neura | |
| identifier doi | 10.1109/TSM.2014.2310223 | |
| journal title | Semiconductor Manufacturing, IEEE Transactions on | |
| journal volume | 27 | |
| journal issue | 2 | |
| filesize | 11797031 | |
| citations | 0 |