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    Challenges of communication in spreading e-governance in rural india 

    Type: Conference Paper
    Author : Agarwal, A.
    Publisher: IEEE
    Year: 2014

    Methods selection and overall process of distribution network planning comprehensive evaluation 

    Type: Conference Paper
    Author : Ma, Li; Liu, Wei; Zhu, Tie-ming
    Publisher: IEEE
    Year: 2014

    Poly-Si active matrix organic light-emitting diode pixel circuit with compensation for threshold voltage and mobility variations 

    Type: Journal Paper
    Author : Ilku Nam; Doo Hyung Woo
    Publisher: IET
    Year: 2014

    Enhanced Operation Characteristics in Poly-Si Nanowire Charge-Trapping Flash Memory Device With SiGe Buried Channel 

    Type: Journal Paper
    Author : Chun-Yuan Chen; Kuei-Shu Chang-Liao; Li-Jung Liu; Wei-Chieh Chen; Tien-Ko Wang
    Publisher: IEEE
    Year: 2014

    A Hybrid a-Si and Poly-Si TFTs Technology for AMOLED Pixel Circuits 

    Type: Journal Paper
    Author : Longyan Wang; Lei Sun; Dedong Han; Yi Wang; Mansun Chan; Shengdong Zhang
    Publisher: IEEE
    Year: 2014

    An Enhanced Voltage Programming Pixel Circuit for Compensating GB-Induced Variations in Poly-Si TFTs for AMOLED Displays 

    Type: Journal Paper
    Author : Chih-Hsiang Ho; Chao Lu; Roy, Kaushik
    Publisher: IEEE
    Year: 2014

    Research on easement-based compensation mode of restricted land for grid construction 

    Type: Conference Paper
    Author : Yan, Liang
    Publisher: IEEE
    Year: 2014

    Problems and solutions of AVC system for regional power network based on the OPEN3000 platform 

    Type: Conference Paper
    Author : Guo Lei; Li Ming; Gao Feng
    Publisher: IEEE
    Year: 2014

    A Novel Hybrid Poly-Si Nanowire LDMOS With Extended Drift 

    Type: Journal Paper
    Author : Jhen-Yu Tsai; Hsin-Hui Hu; Yung-Chun Wu; Yi-Rue Jhan; Kun-Ming Chen; Guo-Wei Huang
    Publisher: IEEE
    Year: 2014

    Spatial mapping of non-uniform time-to-breakdown and physical evidence of defect clustering 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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