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    Chip package interaction induced ILD integrity issues in fine pitch flip chip packages 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Trading-off on-die observability for cache minimum supply voltage reduction in system-on-chip (SoC) processors 

    Type: Conference Paper
    Author : Bowman, Keith; Park, Alex; Narayanan, Venkat; Atallah, Francois; Artieri, Alain; Yoon, Sei Seung; Yuen, Kendrick; Hansquine, David
    Publisher: IEEE
    Year: 2014

    Expressive speech analysis for story telling application 

    Type: Conference Paper
    Author : Patil, Prerna R.; Manjare, Chandraprabha A.
    Publisher: IEEE
    Year: 2014

    Applications of microfluidics for studying growth mechanisms of tip growing pollen tubes 

    Type: Conference Paper
    Author : Nezhad, A.S.; Packirisamy, M.; Geitmann, A.
    Publisher: IEEE
    Year: 2014

    The analysis of integral characteristics of received signal envelope in wireless mobile communications 

    Type: Conference Paper
    Author : Stefanovic, Hana Z.
    Publisher: IEEE
    Year: 2014

    Symbolic regression methods for control system synthesis 

    Type: Conference Paper
    Author : Diveev, Askhat; Kazaryan, David; Sofronova, Elena
    Publisher: IEEE
    Year: 2014

    Model of the speckle noise forprocessing of SAR images 

    Type: Conference Paper
    Author : Sytnik, O.V.; Yefimov, V.B.; Pustovoytenko, V.V.
    Publisher: IEEE
    Year: 2014

    Quantifying Information Flow for Dynamic Secrets 

    Type: Conference Paper
    Author : Mardziel, Piotr; Alvim, Mario S.; Hicks, Michael; Clarkson, Michael R.
    Publisher: IEEE
    Year: 2014

    Analysis of secular variation of the information flow pattern in EEGs of an epileptic patient by Multidimensional directed information analysis 

    Type: Conference Paper
    Author : Sakata, Osamu; Saito, Yoichi; Suzuki, Yutaka
    Publisher: IEEE
    Year: 2014

    Multimodal classification with deformable part-based models for urban cartography 

    Type: Conference Paper
    Author : Randrianarivo, H.; Le Saux, B.; Ferecatu, M.
    Publisher: IEEE
    Year: 2014
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