Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
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سال
: 2014شناسه الکترونیک: 10.1109/ICRAIE.2014.6909295
کلیدواژه(گان): Accuracy,n Arrays,n Navigation,n Web pages,n Relative information matrix,n Web navigation,n ant colony optimization,n normalization,n web pages content..,n web usability
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آمار بازدید
Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
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date accessioned | 2020-03-12T22:53:29Z | |
date available | 2020-03-12T22:53:29Z | |
date issued | 2014 | |
identifier other | 7028362.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1098144 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Chip package interaction induced ILD integrity issues in fine pitch flip chip packages | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8239221 | |
subject keywords | Accuracy | |
subject keywords | n Arrays | |
subject keywords | n Navigation | |
subject keywords | n Web pages | |
subject keywords | n Relative information matrix | |
subject keywords | n Web navigation | |
subject keywords | n ant colony optimization | |
subject keywords | n normalization | |
subject keywords | n web pages content.. | |
subject keywords | n web usability | |
identifier doi | 10.1109/ICRAIE.2014.6909295 | |
journal title | lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th | |
filesize | 953132 | |
citations | 0 |