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    An optimal probing method of pre-bond TSV fault identification in 3D stacked ICs 

    Type: Conference Paper
    Author : Zhang, Bei; Agrawal, Vishwani D.
    Publisher: IEEE
    Year: 2014

    Integrated superlattices and metamaterials 

    Type: Conference Paper
    Author : Tsu, Raphael; Fiddy, Michael A.
    Publisher: IEEE
    Year: 2014

    Wind turbine inverse control: A bond graph approach 

    Type: Conference Paper
    Author : Patino, Carlos; Tapia, Roberto; Medina, Aurelio; Fuerte, Claudio
    Publisher: IEEE
    Year: 2014

    Effective penetration testing with Metasploit framework and methodologies 

    Type: Conference Paper
    Author : Holik, Filip; Horalek, Josef; Marik, Ondrej; Neradova, Sona; Zitta, Stanislav
    Publisher: IEEE
    Year: 2014

    An E-Commerce model based on a multi-agent technology 

    Type: Conference Paper
    Author : Ioan, Mogos Radu
    Publisher: IEEE
    Year: 2014

    BIOSIG 2014 — Biometrics special interest group 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    On-Line Signature Verification Using Symbolic Aggregate Approximation (SAX) and Sequential Mining Optimization (SMO) 

    Type: Conference Paper
    Author : Deivachilai, Rakesh; Oates, Tim
    Publisher: IEEE
    Year: 2014

    Analysis of effective fuzzy-CAC solution for proactive traffic engineering 

    Type: Conference Paper
    Author : Jelinskis, J.; Skrastins, A.
    Publisher: IEEE
    Year: 2014

    Optimum shunt capacitor placement in distribution networks with high penetration of renewable energy resources using genetic algorithms 

    Type: Conference Paper
    Author : Farag, Hany E.Z.; El-Saadany, Ehab F.
    Publisher: IEEE
    Year: 2014

    Vehicles as Big Data Carriers: Road Map Space Reduction and Efficient Data Assignment 

    Type: Conference Paper
    Author : Baron, Benjamin; Spathis, Promethee; Rivano, Herve; de Amorim, Marcelo Dias
    Publisher: IEEE
    Year: 2014
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