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VIX: Virtual Input Crossbar for efficient switch allocation

Type: Conference Paper

Publisher: IEEE

Year: 2014

Simultaneous fabrication of a through-glass interconnect via and a bump using dry film resist and submicron gold particles

Type: Journal Paper

Author : Mimatsu, Hayata; Mizuno, Jun; Shoji, Shuji; Kasahara, T.; Shih, Kailing; Nomura, Keigo; Kanehira, Yukio; Ogashiwa, Toshinori

Publisher: IET

Year: 2014

Energy and DOI Calibrations for High Spatial Resolution CZT Detectors

Type: Journal Paper

Author : Carrascal, J.; Castilla, Javier; Oller, J.C.; Vela, O.; Romero, Lucila; Rato, P.; Perez, J.M.

Publisher: IEEE

Year: 2014

Unmanned helicopter control based on trim predication technology

Type: Conference Paper

Author : Lei, Zhirong; Shi, Long; Li, Jia; Song, Dongliang

Publisher: IEEE

Year: 2014

Author

Carrascal, J. (1)

Castilla, Javier (1)

Kanehira, Yukio (1)

Kasahara, T. (1)

Lei, Zhirong (1)

Li, Jia (1)

Mimatsu, Hayata (1)

Mizuno, Jun (1)

Nomura, Keigo (1)

Ogashiwa, Toshinori (1)

Publisher

IEEE (3)

IET (1)

Year

2014 (4)

Keywords

bump bonding (2)

&lt (1)

/sub&gt (1)

/sup&gt (1)

137&lt (1)

2&lt (1)

adhesion (1)

Application specific integrated circuits (1)

application specific integrated circuits (1)

ASIC noise (1)

Type

Conference Paper (2)

Journal Paper (2)

Language (ISO)

English (4)

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Metadata Only (4)

Publication Title

esign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE (1)

Micro &amp; Nano Letters, IET (1)

Nuclear Science, IEEE Transactions on (1)

uidance, Navigation and Control Conference (CGNCC), 2014 IEEE Chinese (1)

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