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Design Considerations for Cooling High Heat Flux IC Chips With Microchannels

Type: Journal Paper

Author : Kandlikar, Satish G.

Publisher: IEEE

Year: 2014

Robotic Probing of Nanostructures inside Scanning Electron Microscopy

Type: Journal Paper

Author : Zheng Gong; Chen, Brandon K.; Jun Liu; Yu Sun

Publisher: IEEE

Year: 2014

A Design Science Approach to Collective Intelligence Systems

Type: Conference Paper

Author : Kornrumpf, A. , Baumö l, U.

Publisher: IEEE

Year: 2014

Performance Evaluation of an IaaS Opportunistic Cloud Computing

Type: Conference Paper

Publisher: IEEE

Year: 2014

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

Type: Journal Paper

Author : Bhattacharyya, Bidyut K.; Laskar, Nivedita; Debnath, Shoubhik; Baral, Debasis

Publisher: IEEE

Year: 2014

A Wire Bonding Structure Directly Based on Substrate Integrated Waveguide Technology

Type: Journal Paper

Author : Hui Zhang; Wei Hong

Publisher: IEEE

Year: 2014

Performance of Crossed Anisotropy Multilayered CoZrNb Films as IC Chip Level Electromagnetic Noise Suppressor

Type: Journal Paper

Author : Shimada, Yusuke; Jingyan Ma; Ito, Takao; Yanagi, Kenjiro; Endo, Yuta; Muroga, Sho; Yamaguchi, Masaki

Publisher: IEEE

Year: 2014

Improving defectivity for III-V CMP processes for <10 nm technology nodes

Type: Conference Paper

Author : Teugels, L.; Ong, P.; Boccardi, G.; Waldron, N.; Ansar, S.; Siebert, J.M.; Leunissen, L.A.H.

Publisher: IEEE

Year: 2014

Chemical mechanical properties of perovskite oxide abrasive grain: First-principles approach

Type: Conference Paper

Author : Ozawa, N.; Higuchi, Y.; Kubo, M.

Publisher: IEEE

Year: 2014

Optimization of a Multilevel Checkpoint Model with Uncertain Execution Scales

Type: Conference Paper

Author : Sheng Di; Bautista-Gome, L.; Cappello, F.

Publisher: IEEE

Year: 2014

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Design Considerations for Cooling High Heat Flux IC Chips With Microchannels

Robotic Probing of Nanostructures inside Scanning Electron Microscopy

A Design Science Approach to Collective Intelligence Systems

Performance Evaluation of an IaaS Opportunistic Cloud Computing

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

A Wire Bonding Structure Directly Based on Substrate Integrated Waveguide Technology

Performance of Crossed Anisotropy Multilayered CoZrNb Films as IC Chip Level Electromagnetic Noise Suppressor

Improving defectivity for III-V CMP processes for <10 nm technology nodes

Chemical mechanical properties of perovskite oxide abrasive grain: First-principles approach

Optimization of a Multilevel Checkpoint Model with Uncertain Execution Scales

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Design Considerations for Cooling High Heat Flux IC Chips With Microchannels

Robotic Probing of Nanostructures inside Scanning Electron Microscopy

A Design Science Approach to Collective Intelligence Systems

Performance Evaluation of an IaaS Opportunistic Cloud Computing

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

A Wire Bonding Structure Directly Based on Substrate Integrated Waveguide Technology

Performance of Crossed Anisotropy Multilayered CoZrNb Films as IC Chip Level Electromagnetic Noise Suppressor

Improving defectivity for III-V CMP processes for &#x003C;10 nm technology nodes

Chemical mechanical properties of perovskite oxide abrasive grain: First-principles approach

Optimization of a Multilevel Checkpoint Model with Uncertain Execution Scales

Improving defectivity for III-V CMP processes for <10 nm technology nodes