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نمایش تعداد 1-4 از 4

Flip-chip interconnects based on solution deposited carbon nanotube bumps

نوع: Conference Paper

نویسنده : Pingye Xu , Hamilton, M.C.

ناشر: IEEE

سال: 2014

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

نوع: Journal Paper

نویسنده : Pingye Xu; Pfeiffenberger, Alexander H.; Ellis, Charles D.; Hamilton, Michael C.

ناشر: IEEE

سال: 2014

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

نوع: Journal Paper

نویسنده : Pingye Xu; Fei Tong; Davis, Virginia /A/.; Minseo Park; Hamilton, Michael C.

ناشر: IEEE

سال: 2014

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

نوع: Journal Paper

نویسنده : Modic, Aaron; Gang Liu; Ahyi, Ayayi C.; Yuming Zhou; Pingye Xu; Hamilton, Michael C.; Williams, John R.; Feldman, L.C.; Dhar, Sudipta

ناشر: IEEE

سال: 2014

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Flip-chip interconnects based on solution deposited carbon nanotube bumps

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

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Flip-chip interconnects based on solution deposited carbon nanotube bumps

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping