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نمایش تعداد 1-10 از 14
Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs
ناشر: IEEE
سال: 2014
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC
ناشر: IEEE
سال: 2014
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs
ناشر: IEEE
سال: 2014
Power management of shipboard power systems using Interaction Balance Principle
ناشر: IEEE
سال: 2014
Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement
ناشر: IEEE
سال: 2014