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Now showing items 1-7 of 7
Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach
Publisher: IEEE
Year: 2014
Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique
Publisher: IET
Year: 2014
Efficient Determination of Copper Electroplating Chemistry Additives
Publisher: IEEE
Year: 2014
Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects
Publisher: IEEE
Year: 2014
High-frequency reverse-time chaos generation using digital chaotic maps
Publisher: IET
Year: 2014
High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping
Publisher: IEEE
Year: 2014