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Business case for industrial DSM maintenance

Type: Conference Paper

Publisher: IEEE

Year: 2014

Low temperature wafer bonding for wafer-level 3D integration

Type: Conference Paper

Author : Dragoi, V. , Rebhan, B. , Burggraf, J. , Razek, N.

Publisher: IEEE

Year: 2014

Improving the Accuracy of Soil Moisture Retrievals Using the Phase Difference of the Dual-Polarization GNSS-R Interference Patterns

Type: Journal Paper

Author : Alonso-Arroyo, A.; Camps, A.; Aguasca, Albert; Forte, G.; Monerris, A.; Rudiger, Christoph; Walker, Jeffrey P.; Park, Heejung; Pascual, D.; Onrubia, R.

Publisher: IEEE

Year: 2014

Metabolic.Care: A hardware and software platform to monitor and assess diabetic foot condition

Type: Conference Paper

Author : Oliveira, Daniel; Sousa, Paula; Felizardo, Virginie; Garcia, Nuno C.; Alexandre, Celina; Garcia, Nuno M.

Publisher: IEEE

Year: 2014

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Business case for industrial DSM maintenance

Low temperature wafer bonding for wafer-level 3D integration

Improving the Accuracy of Soil Moisture Retrievals Using the Phase Difference of the Dual-Polarization GNSS-R Interference Patterns

Metabolic.Care: A hardware and software platform to monitor and assess diabetic foot condition

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Business case for industrial DSM maintenance

Low temperature wafer bonding for wafer-level 3D integration

Improving the Accuracy of Soil Moisture Retrievals Using the Phase Difference of the Dual-Polarization GNSS-R Interference Patterns

Metabolic.Care: A hardware and software platform to monitor and assess diabetic foot condition