Low temperature wafer bonding for wafer-level 3D integration
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سال
: 2014شناسه الکترونیک: 10.1109/IGARSS.2014.6946967
کلیدواژه(گان): Bayes methods,atmospheric optics,moisture,neural nets,remote sensing,soil,Aquarius/SAC-D observations,Argentina,Bayesian algorithm,H-pol single channel algorithm,Pampas Plains,SMOS Level-2 sm product,V-pol single channel algorithm,artificial neural network,brightness temperature,microwave polarization difference algorithm,optical depth,retrieval algorithms,soil moisture,Artificial neural networks,Bayes methods,Measurement,Optical sensors,Soil moisture,Training,Vegetation
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Low temperature wafer bonding for wafer-level 3D integration
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contributor author | Dragoi, V. , Rebhan, B. , Burggraf, J. , Razek, N. | |
date accessioned | 2020-03-12T20:43:40Z | |
date available | 2020-03-12T20:43:40Z | |
date issued | 2014 | |
identifier other | 6886148.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1023302 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Low temperature wafer bonding for wafer-level 3D integration | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8148124 | |
subject keywords | Bayes methods | |
subject keywords | atmospheric optics | |
subject keywords | moisture | |
subject keywords | neural nets | |
subject keywords | remote sensing | |
subject keywords | soil | |
subject keywords | Aquarius/SAC-D observations | |
subject keywords | Argentina | |
subject keywords | Bayesian algorithm | |
subject keywords | H-pol single channel algorithm | |
subject keywords | Pampas Plains | |
subject keywords | SMOS Level-2 sm product | |
subject keywords | V-pol single channel algorithm | |
subject keywords | artificial neural network | |
subject keywords | brightness temperature | |
subject keywords | microwave polarization difference algorithm | |
subject keywords | optical depth | |
subject keywords | retrieval algorithms | |
subject keywords | soil moisture | |
subject keywords | Artificial neural networks | |
subject keywords | Bayes methods | |
subject keywords | Measurement | |
subject keywords | Optical sensors | |
subject keywords | Soil moisture | |
subject keywords | Training | |
subject keywords | Vegetation | |
identifier doi | 10.1109/IGARSS.2014.6946967 | |
journal title | ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on | |
filesize | 866107 | |
citations | 0 |